Chip Supplier Rings

10 flagship chips · 80 supplier rows · logic die to final test

Each ring maps one flagship chip to the plants that make its logic die, memory, base die, interposer, substrate, packaging and test. Of 80 supplier rows across 10 chips, one has US volume today: the NVIDIA B300 logic die, part of which TSMC makes at Fab 21 in Arizona. Four more are planned, led by the Tesla AI5 dies at Samsung Taylor and TSMC Arizona and SK hynix HBM4 packaging in Indiana.

10 flagship chips by component, each cell shaded by the most US status any supplier of that component has: 1 cells or rows with US volume and 4 US planned BEST US STATUS PER COMPONENT LOGIC DIE MEMORY HBM BASE DIE INTERPOSER SUBSTRATE ABF FILM PACKAGING FINAL TEST NVIDIA B300 NVIDIA B300, Logic die: Some US volume NVIDIA B300, Memory: Made abroad NVIDIA B300, Interposer: Made abroad NVIDIA B300, Substrate: Made abroad NVIDIA B300, ABF film: Made abroad NVIDIA B300, Packaging: Made abroad NVIDIA B300, Final test: Made abroad NVIDIA Rubin NVIDIA Rubin, Logic die: Made abroad NVIDIA Rubin, Memory: Made abroad NVIDIA Rubin, HBM base die: Made abroad NVIDIA Rubin, Substrate: Made abroad NVIDIA Rubin, ABF film: Made abroad NVIDIA Rubin, Packaging: Made abroad NVIDIA Rubin, Final test: US planned AMD MI455X AMD MI455X, Logic die: Made abroad AMD MI455X, Memory: Made abroad AMD MI455X, Interposer: Made abroad AMD MI455X, Substrate: Made abroad AMD MI455X, ABF film: Made abroad AMD MI455X, Packaging: Made abroad AMD MI455X, Final test: Not disclosed Google TPU Ironwood Google TPU Ironwood, Logic die: Made abroad Google TPU Ironwood, Memory: Made abroad Google TPU Ironwood, Substrate: Made abroad Google TPU Ironwood, ABF film: Made abroad Google TPU Ironwood, Packaging: Made abroad Google TPU Ironwood, Final test: Not disclosed AWS Trainium3 AWS Trainium3, Logic die: Made abroad AWS Trainium3, Memory: Made abroad AWS Trainium3, Interposer: Made abroad AWS Trainium3, Substrate: Not disclosed AWS Trainium3, ABF film: Made abroad AWS Trainium3, Packaging: Made abroad AWS Trainium3, Final test: Not disclosed Microsoft Maia 200 Microsoft Maia 200, Logic die: Made abroad Microsoft Maia 200, Memory: Made abroad Microsoft Maia 200, Substrate: Not disclosed Microsoft Maia 200, ABF film: Made abroad Microsoft Maia 200, Packaging: Made abroad Microsoft Maia 200, Final test: Not disclosed Huawei Ascend 910C Huawei Ascend 910C, Logic die: Made abroad Huawei Ascend 910C, Memory: Made abroad Huawei Ascend 910C, Packaging: Made abroad Huawei Ascend 910C, Final test: Made abroad Tesla AI5 Tesla AI5, Logic die: US planned Tesla AI5, Memory: Made abroad Tesla AI5, Packaging: Not disclosed Tesla AI5, Final test: Not disclosed SK hynix HBM4 SK hynix HBM4, Memory: Made abroad SK hynix HBM4, HBM base die: Made abroad SK hynix HBM4, Packaging: US planned SK hynix HBM4, Final test: Made abroad Apple A19 Pro Apple A19 Pro, Logic die: Made abroad Apple A19 Pro, Memory: Made abroad Apple A19 Pro, Packaging: Made abroad Apple A19 Pro, Final test: Not disclosed Some US volume US planned Made abroad Not disclosed No row
Chips
10
Supplier rows
80
US volume today
1 row
US planned
4 rows
Not disclosed
12 rows
Hub
Chips

The chips

Ten Chips, From AI Accelerators to a Phone SoC

Six AI accelerators from NVIDIA, AMD, Google, AWS and Microsoft, the Huawei Ascend 910C on China's own supply chain, Tesla's AI5, the SK hynix HBM4 stack inside most of them, and Apple's A19 Pro as the consumer counterpart.

The rack-scale rings on DatacentersX stop at the accelerator; each ring here opens it. Rows are banded by the most US status any supplier on that chip has.

Flagship chips
ChipDesignerLogic nodePackageMemoryRowsBest US status
NVIDIA Blackwell Ultra B300NVIDIATSMC 4NPCoWoS-L288GB HBM3E 12-high11Some US volume
NVIDIA RubinNVIDIATSMC N3PCoWoS-L288GB HBM412US planned
AMD Instinct MI455XAMDTSMC N2 (compute), N3P (base and I/O)SoIC plus CoWoS-L432GB HBM411Made abroad
Google TPU IronwoodGoogle and BroadcomTSMC N3PCoWoS192GB HBM3E8Made abroad
AWS Trainium3AWS (Annapurna Labs)TSMC N3PTSMC CoWoS-R, two assembliesHBM3E 12-high, 144 GB8Made abroad
Microsoft Maia 200MicrosoftTSMC 3nmCoWoS (inferred)216GB HBM3E6Made abroad
Huawei Ascend 910CHiSilicon (Huawei)SMIC N+2 (7nm-class); some TSMC 7nm diesTwo 910B dies, domestic advanced packagingStockpiled Samsung and SK hynix HBM; CXMT HBM3 next7Made abroad
Tesla AI5TeslaSamsung SF2T (reported); TSMC node not disclosedNot disclosedNone; LPDDR5X reported7US planned
SK hynix HBM4 12-highSK hynix1b DRAM; TSMC 12nm-class base dieTSV stack, MR-MUF36 GB, 2,048-bit5US planned
Apple A19 ProAppleTSMC N3PInFO-PoP (inferred)None; LPDDR5X5Made abroad

US share

What Is Made, or Planned, in the US

  • NVIDIA B300, logic die: TSMC Arizona, Fab 21 (some us volume). First Blackwell wafer at Fab 21 on Oct 17 2025; share of B300 volume not disclosed; wafers return to Taiwan for packaging
  • NVIDIA Rubin, final test: KYEC (US site) (us planned). NVIDIA prepaid for KYEC US test capacity; high-volume test targeted April 2027
  • Tesla AI5, logic die: Samsung Foundry, Taylor fab (us planned). Samsung SF2T (2nm) per SEDaily; tape-out done spring 2026; prototypes marked KR2613 came from a Korean line; volume around 2027
  • Tesla AI5, logic die: TSMC, Fab 21 Arizona and Taiwan fabs (us planned). Musk (Nov 2025): slightly different AI5 versions at TSMC and Samsung; node not disclosed; Hankyung lists TSMC Taiwan and Arizona
  • SK hynix HBM4, packaging: SK hynix, West Lafayette plant (us planned). Broke ground Aug 2026; HBM output 2H 2029

Everything else in the rings is made in Taiwan, South Korea, Japan or China, or its plant is not disclosed. The packaging that joins the dies stays in Taiwan until Amkor's Peoria, Arizona campus opens in 2028; see Foundry Captive Packaging.

Method

How the Rings Are Built

  • Components: logic die, memory (HBM, or LPDDR for phone and car chips), HBM base die, interposer or bridge, package substrate, ABF film, advanced packaging and final test.
  • Evidence: Confirmed (the company says so), Committed (an announced agreement), Claimed (credible press or analyst report) and Inferred (deduced from a supplier's known role; the reason is in the notes).
  • US status: the same five levels as the DatacentersX rings: made in US, some US volume, US planned, made abroad and not disclosed.

Record

Dataset Record

Dataset
sx_chips (10 chips) and sx_chip_rings (80 supplier rows)
Sources
Company releases and filings, TrendForce, SemiAnalysis, DigiTimes, Tom's Hardware, Reuters; a source link on each row
Last verified
October 2026