Semiconductor Conferences

SEMICON · ISSCC · VLSI · IEDM · SPIE Lithography · ECTC · DAC · GTC · COMPUTEX

The chip industry's calendar is moving toward its fabs. SEMICON West, held in the San Francisco Bay Area for 50 years, moves permanently to Phoenix and to spring, starting March 30 to April 1, 2027, next to TSMC's and Intel's Arizona fabs. New results still appear first at three IEEE meetings: ISSCC, VLSI and IEDM.

Major semiconductor conferences from November 2026 through 2027 on a timeline by region. Americas: IEDM, CES, Photonics West, ISSCC, SPIE Advanced Lithography, OFC, NVIDIA GTC, SEMICON West, Chiplet Summit, ECTC, ASMC and DAC. Asia: SEMICON Japan, SEMICON Korea, SEMICON China, SEMICON Southeast Asia, COMPUTEX, VLSI Symposium and SEMICON Taiwan. Europe: SEMICON Europa in November 2026 and November 2027. SEMICON West moves from October 2026 in San Francisco to March 30 to April 1, 2027 in Phoenix, its permanent home. MAJOR CHIP CONFERENCES, NOV 2026 TO DEC 2027 N D J 2027 F M A M J J A S O N D 2026 Americas IEDM CES PHOTONICS WEST ISSCC SPIE LITHO OFC GTC SEMICON WEST CHIPLET SUMMIT ECTC ASMC DAC Asia SEMICON JAPAN SEMICON KOREA SEMICON CHINA SEMICON SEA COMPUTEX VLSI SEMICON TAIWAN Europe SEMICON EUROPA SEMICON EUROPA SEMICON WEST MOVES TO PHOENIX AND SPRING SEMI AND TRADE SHOWS TECHNICAL CONFERENCES COMPANY AND PRODUCT SHOWS SOURCE: SITE DATASET SX_CONFERENCES.CSV, ORGANIZER SITES, OCTOBER 2026.
Events listed
21
SEMICON West 2027
Phoenix, Mar 30
SEMICON Taiwan 2026
130,000+ visitors
COMPUTEX 2026
111,312 visitors
Arizona sites in dataset
8
Hub
Supply Chain

SEMICON West

SEMICON West Leaves San Francisco for Phoenix

After 50 years in the Bay Area, North America's largest chip show moves to Arizona and to spring, starting March 30, 2027.

SEMI held SEMICON West in San Francisco or San Jose for 50 years. The October 13-15, 2026 show at Moscone Center was the last one there: SEMI announced on July 30, 2026 that Phoenix will be the show's long-term home, and that it moves from October to spring. The next three dates are:

  • 2027: March 30 to April 1, Phoenix Convention Center
  • 2028: May 9-11
  • 2029: April 3-5

SEMI gave two reasons. The second half of the year was crowded with its SEMICON India, Taiwan, Europa and Japan shows, and Arizona has drawn more than $200B of chip investment since 2020. The SemiconductorX fab dataset holds eight Arizona sites, from TSMC's Fab 21 phases and Intel's Chandler fabs to the Amkor and TSMC packaging plants planned in Peoria and Phoenix; they are on Fab Clusters.

The first Phoenix show falls on the same three days as Chiplet Summit in Santa Clara, so packaging and chiplet engineers will have to pick one.

Calendar

21 Events From November 2026 to November 2027

The table lists the major events from November 2026 through November 2027 with dates confirmed on organizer sites in October 2026. It is drawn from the site dataset sx_conferences.csv, which will feed this page when it moves to PHP.

  • SEMI and trade shows
  • Technical conferences
  • Company and product shows
Semiconductor conference calendar, November 2026 to November 2027
EventDatesLocationOrganizerFocus
SEMICON Europa 2026Nov 10-13, 2026Munich, GermanySEMIEurope's equipment and materials show, co - located with electronica
SEMICON Japan 2026Dec 9-11, 2026Tokyo, JapanSEMIJapan's equipment, materials and back - end show at Tokyo Big Sight
IEDM 2026Dec 12-16, 2026San Francisco, USAIEEE Electron Devices SocietyTransistor and device research: GAA, CFET, backside power, memory devices
CES 2027Jan 6-9, 2027Las Vegas, USAConsumer Technology AssociationConsumer, PC, automotive and robotics product launches
SPIE Photonics West 2027Jan 30-Feb 4, 2027San Francisco, USASPIELasers, photonics, optoelectronics and silicon photonics
ISSCC 2027Feb 14-18, 2027San Francisco, USAIEEE Solid-State Circuits SocietyChip design results: processors, AI accelerators, memory interfaces, power
SEMICON Korea 2027Feb 17-19, 2027Seoul, South KoreaSEMIKorea's memory, HBM and foundry supply chain at COEX
SPIE Advanced Lithography + Patterning 2027Feb 21-25, 2027San Jose, USASPIEEUV and High - NA EUV, patterning, masks, resist and metrology
OFC 2027Mar 7-11, 2027Los Angeles, USAOptica and IEEEOptical networking, co - packaged optics and data center interconnect
NVIDIA GTC 2027Mar 15-18, 2027San Jose, USANVIDIAAI platform roadmap: GPUs, CPUs, networking, racks
SEMICON China 2027Mar 24-26, 2027Shanghai, ChinaSEMIChina's equipment, materials and fab supply chain at SNIEC
Chiplet Summit 2027Mar 30-Apr 1, 2027Santa Clara, USAChiplet SummitChiplets, UCIe, die - to - die interfaces and heterogeneous integration
SEMICON West 2027Mar 30-Apr 1, 2027Phoenix, USASEMINorth America's equipment and materials show; first edition in its permanent Phoenix home
SEMICON Southeast Asia 2027May 25-27, 2027Kuala Lumpur, MalaysiaSEMIAssembly, test and back - end manufacturing in Southeast Asia
COMPUTEX 2027Jun 1-4, 2027Taipei, TaiwanTAITRAPC, server and AI hardware launches from the Taiwan supply chain
ECTC 2027Jun 1-4, 2027Aurora, USAIEEE Electronics Packaging SocietyAdvanced packaging: CoWoS - class, hybrid bonding, HBM, substrates, thermal
ASMC 2027Jun 14-17, 2027Albany, USASEMIFab manufacturing: yield, process control, defect reduction, automation
VLSI Symposium 2027Jun 20-24, 2027Kyoto, JapanIEEE and JSAPProcess technology and circuits at the Rihga Royal Hotel Kyoto
DAC 2027Jul 10-16, 2027San Jose, USADAC (ACM SIGDA and IEEE CEDA)Electronic design automation, chip design and AI for design
SEMICON Taiwan 2027Aug 18-20, 2027Taipei, TaiwanSEMITaiwan's foundry, packaging and equipment show; moved three weeks earlier
SEMICON Europa 2027Nov 16-19, 2027Munich, GermanySEMIEurope's equipment and materials show at Messe Muenchen

SPIE Advanced Lithography + Patterning, SEMICON China and Chiplet Summit dates come from event listings rather than the organizer's own page and should be rechecked before travel. NVIDIA lists GTC 2027 as March 15-18, with training on March 14.

Technical meetings

New Chip Results Appear First at ISSCC, VLSI and IEDM

New chip results appear first at three IEEE meetings, each a peer-reviewed conference where companies publish data they will not put in a press release:

  • ISSCC (February, San Francisco): circuit and chip design, including processor, AI accelerator, memory interface and power results from NVIDIA, AMD, Intel, Apple, Samsung, SK hynix, TSMC and MediaTek.
  • VLSI Symposium (June, alternating between Kyoto and Honolulu): process technology and circuits together; 2027 is in Kyoto, 2028 in Honolulu.
  • IEDM (December, San Francisco): transistors and devices, where gate-all-around, CFET, backside power and new memory cells are first shown.

Two more set the agenda for one part of the chain each: SPIE Advanced Lithography + Patterning for EUV and High-NA EUV, and ECTC for advanced packaging, hybrid bonding and HBM stacking. The steps behind them are on Photolithography and Advanced Packaging.

SEMICON shows

SEMI Runs a Show in Every Chip Region, and Taiwan's Is the Largest

SEMI, the equipment and materials trade association, runs a SEMICON show in each major chip region, and the size of each tracks the region's spending. SEMICON Taiwan 2026 drew more than 130,000 visitors from 65 countries and over 1,300 exhibitors in 4,300 booths, both records, and its 2027 edition moves three weeks earlier to August 18-20 to secure halls. SEMICON Korea centers on memory and HBM, SEMICON China on domestic toolmakers, SEMICON Japan on materials and equipment, and SEMICON Southeast Asia on assembly and test in Malaysia, Singapore and Vietnam. SEMICON India runs in the second half of the year.

China's own industry meets at SEMICON China in Shanghai, where Naura, AMEC and other domestic toolmakers show tools that Western makers cannot sell there; the export controls behind that are on China Bifurcation.

Company keynotes

GTC and COMPUTEX Set the AI Hardware Calendar

Company keynotes now set the product calendar for AI hardware. NVIDIA uses GTC in March for its GPU, CPU and rack roadmap, and COMPUTEX in Taipei in June brings the Taiwan server, board and PC makers that build those racks: COMPUTEX 2026 drew 111,312 professional visitors from 152 countries and regions. OFC in March covers the optical links and co-packaged optics that connect the racks, and CES in January the consumer, PC and automotive launches. What those platforms need from the chip supply chain is on AI Data Center and NVIDIA.

By chain stage

Each Part of the Chain Has Its Own Meeting

Where each conference sits on the chip supply chain. Design: DAC, ISSCC and Chiplet Summit. Devices: IEDM and VLSI Symposium. Lithography: SPIE Advanced Lithography and Patterning and Photonics West. Fab and tools: the SEMICON shows and ASMC. Packaging: ECTC and SEMICON Southeast Asia. Systems: NVIDIA GTC, COMPUTEX, OFC and CES. WHERE EACH CONFERENCE SITS ON THE CHAIN Design DAC ISSCC Chiplet Summit Devices IEDM VLSI Symposium Lithography SPIE Advanced Litho Photonics West Fab and tools SEMICON shows ASMC Packaging ECTC SEMICON SEA Systems GTC COMPUTEX OFC CES SEMICON SHOWS COVER THE WHOLE CHAIN; THEY ARE PLACED WITH TOOLS, WHERE THEIR EXHIBIT FLOORS CENTER.

For a buyer or engineer working one part of the chain, the short list is: DAC and ISSCC for design, IEDM and VLSI for devices, SPIE Advanced Lithography for patterning, ASMC for fab yield and process control, ECTC for packaging, and the regional SEMICON show for tools and materials.

Record

Page Record

Covers
Major semiconductor conferences and trade shows from November 2026 to November 2027, the SEMICON West move to Phoenix, technical meetings, regional SEMICON shows, company keynotes and the chain stage each event covers
Sources
Site dataset sx_conferences.csv (21 events, verified October 25, 2026); SEMI press release on SEMICON West (July 30, 2026); IEDM 2026 call for papers; ISSCC 2027 call for papers; VLSI Symposium future symposia page; semiconkorea.org; Messe Muenchen (SEMICON Europa 2027); OFC, ASMC and NVIDIA GTC pages; Silicon Saxony and Bayern International (SEMICON Taiwan and Southeast Asia 2027); DAC press release (June 19, 2025); Fraunhofer IPMS (Photonics West 2027); Focus Taiwan (SEMICON Taiwan 2026, September 8, 2026); CNA (COMPUTEX 2026 and 2027); event listings for SPIE Advanced Lithography, SEMICON China and Chiplet Summit 2027
Last verified
October 2026