Semiconductor Workforce

Technicians · engineers · new US fabs · Taiwan, Korea, China · Natcast · community colleges

The US chip workforce gap is mostly on the fab floor. About 67,000 US chip jobs could go unfilled by 2030, and 39% of them are technicians with a certificate or two-year degree, while 15 US fab, packaging and test projects in the SemiconductorX dataset start production between 2026 and 2031.

Top: the Semiconductor Industry Association projects about 67,000 US chip jobs unfilled by 2030. Technicians with a certificate or two-year degree are 39%, about 26,100; engineers and computer scientists with four-year degrees 35%, about 23,500; engineers with master's or PhD degrees 26%, about 17,400. Bottom: US fab and packaging projects in the SemiconductorX dataset that start production each year: 2026: 1, 2027: 4, 2028: 6, 2029: 1, 2030: 2. US CHIP JOBS UNFILLED BY 2030, BY DEGREE (SIA) 39% ~26,100 Technicians CERTIFICATE, TWO-YEAR 35% ~23,400 Engineers, CS FOUR-YEAR DEGREE 26% ~17,400 Engineers MASTER'S OR PHD ABOUT 67,000 OF 115,000 NEW JOBS, AT CURRENT DEGREE COMPLETION RATES. SIA AND OXFORD ECONOMICS, JULY 2023. COUNTS COMPUTED FROM SHARES. US FAB AND PACKAGING PROJECTS STARTING EACH YEAR SAMSUNG TAYLOR 2026 KYEC US TEST MICRON ID1 TSMC AZ P2 TERAFAB 2027 AMKOR PEORIA INTEL FAB 62 LUMENTUM NC MICRON ID2 TSMC AZ PKG TSMC AZ P3 2028 SK HYNIX IND. 2029 INTEL OHIO MICRON CLAY 2030 LOGIC MEMORY PACKAGING AND TEST
US jobs unfilled by 2030
~67,000
Technician share
39%
US projects to staff
15
Taiwan openings a month
47,000
China gap, 2022
~35,000
Hub
Supply Chain

The US gap

Technicians Are the Largest Share of the US Chip Workforce Gap

About 67,000 US chip jobs could go unfilled by 2030, and 39% of them are technicians with a certificate or two-year degree.

The Semiconductor Industry Association and Oxford Economics project that US chip industry employment grows from about 345,000 to about 460,000 jobs by 2030. At current degree completion rates about 67,000 of the 115,000 new jobs go unfilled, 58% of new jobs and 80% of new technical jobs. The largest share is not PhDs:

Projected unfilled US semiconductor jobs by 2030
RoleTypical credentialShare of gapAbout
TechniciansCertificate or two-year degree39%26,100
Engineers and computer scientistsFour-year degree35%23,500
EngineersMaster's or PhD26%17,400

The counts are computed from SIA's shares. A McKinsey and SEMI Foundation estimate reported in October 2026 puts the shortfall as high as 157,000 by 2030, and says only about 3% of US engineering graduates choose chip careers. The skills behind each role are on Skill Sets.

New US sites

15 US Chip Projects Must Be Staffed Between 2026 and 2031

The SemiconductorX fab dataset holds 15 US fab, packaging and test projects that are not yet in volume production. Each needs its technicians trained before its first tools arrive, and training has moved next to the sites:

US fab, packaging and test projects not yet in volume production
ProjectLocationStartTypeTraining tie named on this page
Samsung Taylor Texas (2nm)Taylor, Texas2026Leading EdgeAustin Community College, UT Austin and Texas Institute for Electronics training center
KYEC US Test SiteSite not announced2027TestNone identified
Micron Boise ID1 (DRAM)Boise, Idaho2027MemoryMicron registered apprenticeship with College of Western Idaho
TSMC Fab 21 phase 2 (N3)Phoenix, Arizona2027Leading EdgeTSMC apprenticeship with Estrella Mountain CC, Rio Salado College, NAU
Terafab Grimes CountyAnderson (Grimes County), Texas2027Leading EdgeNone identified
Amkor Arizona (Peoria)Peoria, Arizona2028PackagingNone identified
Intel Fab 62 (Chandler)Chandler, Arizona2028Leading EdgeMaricopa Community Colleges Quick Start, built with Intel
Lumentum Greensboro NC (InP lasers)Greensboro, North Carolina2028III-V/RFNone identified
Micron Boise ID2 (DRAM)Boise, Idaho2028MemoryMicron registered apprenticeship with College of Western Idaho
TSMC Arizona Advanced PackagingPhoenix, ArizonaBefore 2029PackagingTSMC apprenticeship with Estrella Mountain CC, Rio Salado College, NAU
TSMC Fab 21 phase 3 (N2/A16)Phoenix, Arizona2028-2029Leading EdgeTSMC apprenticeship with Estrella Mountain CC, Rio Salado College, NAU
SK hynix West Lafayette (HBM packaging)West Lafayette, Indiana2029PackagingPurdue University semiconductor degrees, Ivy Tech
Intel Ohio New Albany (Intel 14A)New Albany, Ohio2030-2031Leading EdgeNone identified
Micron Clay (DRAM megafab)Clay, New York2030MemoryOnondaga Community College Micron cleanroom lab, Syracuse University
Texas Instruments LFAB2 (300mm)Lehi, UtahNot datedAnalogNone identified

Samsung's first Taylor fab alone is reported at about 3,500 jobs. Start years come from company statements and the dataset; Intel Ohio is delayed to 2030-2031 and TI's second Lehi fab has no date. Site detail is on Fab Facilities.

Taiwan, Korea, China

Taiwan's Chip Openings Reached 47,000 a Month in 2026

The US competes for the same people that Taiwan, Korea and China are short of:

  • Taiwan: 104 Job Bank counted an average of 47,000 semiconductor job openings a month in 2026, up more than 20%, and more than 10,000 a month, one in four, are AI-related. Postings for assignments in the US and Canada rose from 247 a month in 2025 to 593 in 2026.
  • South Korea: Samsung and SK hynix fund contract departments whose graduates are hired on completion; for the class entering in 2027 Samsung offers 350 seats across seven universities, including Yonsei and Sungkyunkwan, and SK hynix 110 across three, including Korea University and Sogang.
  • China: a 2023 report by Arm China and Beyond Consulting put 2022 demand at about 199,300 chip workers against a supply of about 164,300, a gap of about 35,000. Beijing made integrated circuits a first-level academic discipline in 2021, and Tsinghua, Peking and other universities opened Schools of Integrated Circuits.

The university programs in each country are on Universities.

Federal programs

The Federal Workforce Center Lost Its Operator in 2025

The CHIPS Act put workforce money in two places: grants to individual fab projects, which carry workforce commitments, and the National Semiconductor Technology Center, whose operator Natcast ran a Workforce Center of Excellence. In late August 2025 Commerce Secretary Howard Lutnick ended the government's agreement with Natcast, calling it a slush fund, and the center's work moved to NIST without its staff. The same month Commerce withdrew funding for the $1.1B NSTC prototyping and advanced packaging facility planned at Arizona State University's research park.

Industry money filled part of the gap. Applied Materials put about $200M into the $270M Materials-to-Fab Center that opened at ASU in October 2025, where students and researchers work on production tools. The current state of CHIPS awards and programs is on CHIPS and Science Act and Programs and Incentives.

Training

Technician Training Has Moved Next to the Fabs

Most US technician training now runs through community colleges partnered with one chipmaker:

  • Maricopa Community Colleges, Arizona: the Semiconductor Quick Start, built with Intel, is 10 four-hour classes over two weeks for three college credits, with a $270 stipend covering tuition for Arizona residents.
  • TSMC Arizona apprenticeship: a registered program with facilities, equipment and process technician tracks taught with Estrella Mountain Community College, Rio Salado College and Northern Arizona University; apprentices earn a journeyman card.
  • Onondaga Community College, New York: a 3,000 sq ft Micron cleanroom simulation lab with tools donated by Micron opened in October 2025 for the Clay fabs.
  • College of Western Idaho: Micron's two-year registered apprenticeship had produced about 50 technicians by February 2026, against about 200 Micron needs for the Boise fabs due in 2027.
  • Austin Community College and UT Austin: a Semiconductor Training Center with the Texas Institute for Electronics, which committed $3.75M to start it.

SEMI added micro-credentials for cleanroom operations and fab maintenance in 2026. The credentials and standards a fab worker meets are on Certifications and Training.

Workforce pages

Workforce Coverage on SemiconductorX

  • Universities: the university programs placed next to new fabs in the US, Taiwan, Korea, China, Japan and Europe.
  • Certifications and Training: technician programs and the equipment, quality, safety and security standards fab work is done to.
  • Skill Sets: which skills employers are hiring for, from equipment technicians to AI yield engineers.
  • Conferences: the 2026 and 2027 calendar, with SEMICON West moving to Phoenix.

Record

Page Record

Covers
Projected US semiconductor workforce gap by role, US fab and packaging projects to be staffed, Taiwan, Korea and China talent demand, the end of Natcast's workforce center, and community college and apprenticeship training
Sources
SIA and Oxford Economics, Chipping Away (July 2023); VnExpress International citing McKinsey and the SEMI Foundation (October 3, 2026); SemiconductorX fab dataset (October 2026); Focus Taiwan on 104 Job Bank (September 8, 2026); United Daily News on the 104 tech talent report (April 28, 2026); FNN on Korean contract departments (April 26, 2026); Digitimes Asia via Laoyaoba on the Arm China and Beyond Consulting report (July 2023); Work Shift on Natcast (September 2025); KJZZ on the ASU Materials-to-Fab Center (October 9, 2025); Business Wire on Maricopa Quick Start (March 2022); BoiseDev on Micron and College of Western Idaho (April 14, 2026); TSMC Arizona apprenticeship page; WRVO on Onondaga Community College (October 2, 2025); UT Austin Cockrell School (March 28, 2024); SEMI Foundation credentialing page
Last verified
October 2026