| Certification / Standard |
Scope / Purpose |
| ISO 9001 |
Quality management systems – baseline certification across fabs, OSATs, and suppliers. |
| IATF 16949 |
Automotive quality management, critical for automotive chip suppliers. |
| ISO 13485 |
Quality system for medical device semiconductor applications. |
| ISO 14644 |
Cleanroom classification & contamination control (widely used in fabs). |
| SEMI S2 / SEMI S8 / SEMI S10 |
Equipment safety and ergonomic standards by SEMI. |
| SEMI E10 / E79 / E116 |
Equipment performance, reliability, and productivity standards. |
| JEDEC Standards |
Semiconductor device reliability, packaging, memory, thermal, etc. |
| ANSI/ESD S20.20 |
Electrostatic discharge (ESD) protection standard for fabs and labs. |
| IPC Standards (IPC-A-610, IPC-7711, IPC-7721, etc.) |
PCB assembly and rework standards, relevant to semiconductor packaging. |
| Certification / Standard |
Scope / Purpose |
| ISO 14001 |
Environmental management system. |
| ISO 45001 (OHSAS 18001) |
Occupational health and safety management. |
| ISO 50001 |
Energy management systems – relevant for fabs with massive energy use. |
| Responsible Business Alliance (RBA) Certification |
Covers labor, ethics, environment in electronics supply chain. |
| LEED / BREEAM / Green Building Certifications |
Applied to fabs and advanced packaging facilities. |
| UL GREENGUARD / RoHS / REACH |
Hazardous materials and emissions compliance. |
| Wastewater Discharge Permits / EPA Clean Air Act Compliance |
For fab emissions & waste handling. |
| Certification / Standard |
Scope / Purpose |
| AEC-Q100 / AEC-Q200 |
Automotive qualification standards for ICs and passive components. |
| JEDEC JESD47 |
Reliability qualification of semiconductor devices. |
| MIL-STD-883 / MIL-PRF-38535 |
Military-grade microelectronics testing. |
| RTCA/DO-254 |
Avionics chip design assurance. |
| NASA Level 1/2/3 EEE-INST-002 |
Space-grade electronic component assurance. |
| ISO/TS 16949 |
Predecessor to IATF 16949, auto-related quality/reliability. |
| Certification / Standard |
Scope / Purpose |
| Conflict-Free Smelter (RMAP) |
Assurance that tin, tantalum, tungsten, gold (3TG) are conflict-free. |
| ITAR / EAR Compliance |
Export controls for U.S. semiconductor and defense chips. |
| Chip Act / EU Chips Act Reporting Standards |
Government compliance for subsidies & transparency. |
| Customs-Trade Partnership Against Terrorism (C-TPAT) |
Secure supply chain certification. |
| Certification / Standard |
Scope / Purpose |
| SEMI Certs (e.g., SEMI University) |
Training and certifications for fab operations, safety, and equipment. |
| IPC Certified Interconnect Designer (CID / CID+) |
PCB and package substrate design certification. |
| Certified Semiconductor Professional (CSP) |
Industry training credential for fab engineers and managers. |
| Lean Six Sigma (Green Belt / Black Belt) |
Process improvement – widely applied in fabs. |
| OSHA 10/30 |
Occupational safety training for fab and equipment engineers. |
| Cleanroom Technician Certification Programs |
Vendor/college-based programs, often fab-specific. |
