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Semiconductor Bottleneck Atlas

U.S. Semiconductor Sovereignty Constraints

U.S. Semiconductor Reshoring

Tesla Terafab Supply Chain

Business Models

Process Nodes & Lines

Mature Node MCUs

MATERIALS & IP

FABRICATION & ASSEMBLY

FAB FACILITIES

FAB EQUIPMENT
- Wafer Fab Equipment (WFE)
- Packaging Equipment (WLP)
  - Hybrid Bonding Equipment
  - Inspection & Metrology Equipment
- Test Equipment
  - Automated Test Equipment (ATE)
  - ATE Probe Cards
- FAB MANUFACTURING FLOW
  - 1. FRONT END FABRICATION
    - Incoming Wafers
    - Incoming Photomasks
    - Wafer Cleaning (80-120x)
    - Wafer Oxidation (varies)
    - Wafer Deposition (80-120x)
    - Photolithography (~90x)
    - Wafer Photoresist (~90x)
    - Wafer Etching (80-120x)
    - Wafer Doping (varies)
    - Planarization (CMP) (80-120x)
    - Metallization
    - Metrology & Inspection (80-120x)
    - Process Control
  - 2. WAFER SORT TEST
  - 3. BACK-END ASSEMBLY & PACKAGING
  - 4. MODULE INTEGRATION
  - EMS & OEMs

CHIP TYPES

SECTORS

FAB OPS