Advanced
Packaging
Advanced packaging bridges the gap between traditional die-level assembly and next-generation system integration. As Moore’s Law scaling slows, performance gains increasingly come from packaging innovations that combine multiple dies, chiplets, and memory stacks into a single module. Techniques such as CoWoS, InFO, Foveros, and EMIB enable high-bandwidth, low-latency connections that are critical for AI accelerators, high-performance computing (HPC), mobile devices, and automotive electronics.
Role in the Semiconductor Supply Chain
- Integration: Combines logic, memory, RF, power, and sensors into one system-in-package (SiP).
- Performance: Provides shorter interconnects, higher bandwidth, and improved thermal paths compared to PCB-level integration.
- Scaling Beyond Moore’s Law: Enables heterogeneous integration when transistor scaling is insufficient.
- Strategic Importance: Limited capacity and high complexity make advanced packaging a geopolitical and industrial bottleneck.
Key Advanced Packaging Technologies
| Technology | Developer | Description | Key Applications | Examples |
|---|---|---|---|---|
| CoWoS (Chip-on-Wafer-on-Substrate) | TSMC | 2.5D interposer technology bonding multiple dies and HBM stacks on a silicon interposer. | AI accelerators, GPUs, HPC | NVIDIA H100/H200, AMD MI300 |
| InFO (Integrated Fan-Out) | TSMC | Fan-out wafer-level packaging with RDL (redistribution layers) for thin, high-density designs. | Mobile SoCs, wearable processors | Apple A-series and M-series |
| Foveros | Intel | 3D die stacking with through-silicon vias (TSVs) and micro-bumps for vertical integration. | CPUs, AI accelerators | Intel Meteor Lake, Ponte Vecchio |
| EMIB (Embedded Multi-Die Interconnect Bridge) | Intel | 2.5D bridge technology embedding a small silicon interconnect into a package substrate. | FPGAs, CPUs with GPU/accelerator chiplets | Intel Stratix 10, Xeon + GPU modules |
| I-Cube | Samsung | Interposer-based 2.5D solution for logic-memory integration. | AI, HPC, networking | HBM + logic chip integration |
| Fan-Out WLP (FO-WLP) | Various (ASE, Amkor, TSMC) | Redistribution of I/O pads over an encapsulated die with added RDL layers. | Mobile, IoT, RF, automotive | Broad adoption in consumer SoCs |
| 2.5D Interposers | Foundries/OSATs | Large silicon or organic interposers providing high-bandwidth die-to-die connections. | HPC, networking, GPUs | NVIDIA/AMD GPUs with HBM |
| 3D IC / Hybrid Bonding | TSMC, Intel, Sony | Direct bonding of copper-to-copper or dielectric-to-dielectric interconnects at wafer or die level. | Memory stacking, chiplets, sensors | Sony CMOS image sensors, TSMC SoIC |
| SiP (System-in-Package) | Multiple | Combines logic, memory, RF, sensors, and power management in a single package/module. | Mobile, IoT, automotive | Apple Watch SiP, Qualcomm RF modules |
Cleanroom & Environment
- Typically performed in Class 1000–10,000 assembly areas; advanced hybrid bonding may require Class 100–1000.
- Thermal management (e.g., lid attach, TIMs) is a critical part of the process environment.
- Moisture control and warpage mitigation are critical for fan-out and large interposers.
Advantages & Constraints
- Advantages: Enables heterogeneous integration, high bandwidth, and lower latency; reduces form factor; supports performance scaling beyond Moore’s Law.
- Constraints: Expensive; capacity limited to leading foundries/OSATs; warpage and yield issues for large interposers; thermal challenges for high-power AI/HPC modules.
Market Outlook
Advanced packaging is becoming one of the most strategic bottlenecks in the semiconductor supply chain. By 2030, demand for CoWoS and similar high-density interconnects will outstrip capacity, particularly for AI accelerators and memory-rich HPC devices. Foundries (TSMC, Intel, Samsung) are vertically integrating packaging alongside their fab services, challenging OSATs. Governments are increasingly treating packaging as a national security priority alongside fabs.
Meta Data
- Meta Title: Advanced Packaging in Semiconductors | CoWoS, InFO, Foveros, 3D IC
- Meta Description: Advanced packaging integrates chiplets, logic, and memory with technologies like CoWoS, InFO, and Foveros. Explore methods, vendors, applications, and market outlook.