Leading-edge logic
Three of Nine Leading-Edge Sites Run Today
The US makes leading-edge logic wafers at volume again, at three sites. TSMC Fab 21 phase 1 in Phoenix has run TSMC's N4 process since the fourth quarter of 2024, Intel Fab 52 in Chandler reached high-volume Intel 18A production in October 2025, and Intel D1X in Hillsboro, Oregon develops Intel's next nodes on ASML High-NA EUV scanners.
Six more leading-edge sites are being built: TSMC Fab 21 phases 2 and 3 (N3 in the second half of 2027, then N2 and A16), Intel Fab 62 in Chandler, Intel Ohio One, Samsung Taylor (2nm, volume in 2027) and the Terafab Production Fab in Grimes County, Texas. Node detail for each is at Leading-Edge Logic Fabs and Process Nodes.
The rest of the US base is older and already running: 6 of 7 analog plants, most of them Texas Instruments 300mm fabs, and almost all the mature-logic, power and RF plants in the dataset make chips in the US today.
Memory and packaging
Memory and Packaging Arrive Last
An AI accelerator is a logic die, stacks of high-bandwidth memory (HBM) and an advanced package that joins them. The US has the first of the three. None of the three new US DRAM fabs runs yet, and of five advanced packaging and test sites only Intel Fab 9 in New Mexico runs, packaging Intel's own products. So NVIDIA Blackwell wafers made in Arizona still go back to Taiwan for CoWoS packaging (NVIDIA spotlight).
By state
Texas and Arizona Hold Most of the New Capacity
Texas has the most US chip plants in the dataset and Arizona the most new ones. Texas mixes a leading-edge foundry, the largest US analog campus, a 14nm to 65nm Samsung foundry in Austin and a captive AI chip program. Arizona is where leading-edge logic and the first US advanced packaging for AI chips are being built side by side. Reasons the two states draw this capacity are worked through on AustinIO at Why Texas. One Texas proposal is not in the count yet: Substrate Project Factory One, a fab of at least $10 billion proposed for the Texas A&M RELLIS campus in Bryan to run the startup's own X-ray lithography tools, with no construction start announced.
| State | Plants | What they make | Status |
|---|---|---|---|
| Texas | Samsung Taylor (2nm foundry); Texas Instruments Sherman SM1 and Richardson RFAB1 and RFAB2 (Sherman cluster); Samsung Austin S2; NXP Austin; Terafab (Grimes County) | 2nm logic; 300mm analog; 14nm to 65nm foundry; automotive MCUs; captive AI chips | TI SM1 in volume since December 2025; Samsung Taylor volume 2027; Terafab limited operations targeted late 2027 |
| Arizona | TSMC Fab 21 phases 1 to 3 and two packaging plants; Intel Fab 52 and Fab 62; Amkor Peoria | N4, N3, N2 and A16 logic; Intel 18A; CoWoS and advanced packaging | TSMC phase 1 since Q4 2024; Intel Fab 52 since October 2025; TSMC phase 2 second half 2027; Amkor early 2028 |
| New York | Micron Clay; GlobalFoundries Fab 8, Malta | DRAM; specialty logic, silicon photonics and GaN | GlobalFoundries running; Micron Clay first fab Q3 2030 |
| Idaho | Micron Boise ID1 and ID2 | Leading-edge DRAM; HBM in ID2 | ID1 first wafers mid-2027; ID2 late 2028 |
| Ohio | Intel Ohio One, New Albany | Intel 14A | First fab 2030 to 2031; second fab 2032 |
| Oregon | Intel D1X, Hillsboro; Analog Devices Beaverton | Intel process development with High-NA EUV; analog | Running |
| Utah | Texas Instruments Lehi LFAB1 and LFAB2 | 300mm analog | LFAB1 running; LFAB2 under construction |
| Indiana | SK hynix West Lafayette | HBM stacking and test for wafers made in Korea | Ground broken August 2026; volume second half 2029 |
| New Mexico | Intel Fab 9, Rio Rancho | Foveros 3D packaging for Intel products | Running since 2024 |
Timeline
Most Dates Have Slipped Two to Five Years
Of the large projects, only TSMC Arizona Fab 2 has moved earlier, pulled forward by AI demand. Micron Clay moved from 2028 to the third quarter of 2030 after its wetlands review, Intel Ohio from 2025 to 2030 to 2031, and Amkor from 2027 to 2028 after moving its site. The Congressional Research Service counts the last contracted CHIPS milestone in 2033. What slows each project is ranked at Sovereignty Constraints.
| Date | Project | Location | Milestone |
|---|---|---|---|
| Q4 2024 (achieved) | TSMC Fab 21 phase 1 | Phoenix, Arizona | N4 volume production |
| May 2025 (achieved) | GlobalWafers America | Sherman, Texas | First US plant for 300mm silicon wafers opens |
| October 2025 (achieved) | Intel Fab 52 | Chandler, Arizona | Intel 18A high-volume production |
| December 2025 (achieved) | Texas Instruments SM1 | Sherman, Texas | 300mm analog volume production |
| 2027 | Samsung Taylor | Taylor, Texas | 2nm volume for Tesla and others; initially 2024 |
| Mid-2027 | Micron ID1 | Boise, Idaho | First DRAM wafer output |
| Second half 2027 | TSMC Fab 21 phase 2 | Phoenix, Arizona | N3 volume; once delayed, then pulled forward a year |
| Late 2027 | Terafab Production Fab | Grimes County, Texas | Limited operations (SpaceX target) |
| Early 2028 | Amkor Arizona | Peoria, Arizona | Packaging and test; initially 2027, site moved |
| Late 2028 | Micron ID2 | Boise, Idaho | First wafers, including HBM |
| Second half 2029 | SK hynix West Lafayette | West Lafayette, Indiana | HBM packaging volume |
| 2030 to 2031 | Intel Ohio One | New Albany, Ohio | First fab; initially 2025, at risk without a 14A customer |
| Q3 2030 | Micron Clay | Clay, New York | First fab; initially 2028; four-fab buildout runs to 2041 |
AI chips
One of 80 AI Chip Supply Links Runs in the US
The site tracks the supply ring of 10 AI chips, from NVIDIA Rubin to Huawei Ascend 910C: 80 links from logic die to final test. One link runs in the US: the B300 logic die, made in part at TSMC Fab 21 in Arizona since October 2025 and sent back to Taiwan for packaging. Four more are planned. Everything else is made abroad, mostly in Taiwan and South Korea (Chip Supplier Rings).
- Made in US
- Some US volume
- US planned
| Chip | Component | US plant | US status |
|---|---|---|---|
| NVIDIA Blackwell Ultra B300 | Logic die | TSMC Arizona, Fab 21, Phoenix | Some US volume |
| NVIDIA Rubin | Final test | KYEC (US site) | US planned |
| Tesla AI5 | Logic die | Samsung Foundry, Taylor fab, Taylor, TX | US planned |
| Tesla AI5 | Logic die | TSMC, Fab 21 Arizona and Taiwan fabs, Phoenix, AZ | US planned |
| SK hynix HBM4 12-high | Advanced packaging | SK hynix, West Lafayette plant, West Lafayette, IN | US planned |
Record
Page Record
- Covers
- US chip plants by type, status and state; the order in which logic, memory and packaging arrive; milestone dates; US links in AI chip supply rings
- Sources
- SemiconductorX fab dataset and chip supply ring dataset (October 2026); Congressional Research Service R49031 (July 14, 2026); GAO-26-109121 (August 6, 2026); TSMC, Intel, Micron, Samsung, SK hynix, Amkor and Texas Instruments announcements.
- Last verified
- October 2026