Adv Packaging
SiP
l
System-in-Package (SiP) is an advanced packaging approach that integrates multiple heterogeneous components—logic, memory, RF, analog, power management, sensors, and passives—into a single compact package. Unlike single-die packages, SiP enables full system functionality at the package level, reducing size, improving performance, and enabling new form factors. SiP is widely used in mobile, IoT, wearables, and increasingly in automotive and AI edge devices.
Process Overview
- Step 1: Multiple bare dies and passives are selected and verified as known-good dies (KGD).
- Step 2: Dies are integrated onto a substrate, interposer, or reconstituted wafer, often with fan-out packaging.
- Step 3: Interconnects are formed using redistribution layers (RDL), wire bonding, flip-chip, or hybrid bonding.
- Step 4: Additional passives (capacitors, inductors, filters) and MEMS may be integrated.
- Step 5: Final encapsulation, lid attach, and testing yield a complete system package.
Key Features
- Heterogeneous Integration: Combines multiple functions (compute, RF, memory, sensors) in one package.
- Miniaturization: Reduces PCB footprint and z-height for consumer and IoT devices.
- Performance: Short interconnects improve latency, bandwidth, and power efficiency vs board-level integration.
- Design Flexibility: Supports combinations of dies from different process nodes or foundries.
Applications
- Mobile: Apple Watch SiP integrates CPU, memory, sensors, and power management in one package.
- IoT Devices: Connectivity modules integrating logic + RF + sensors.
- Automotive: SiPs for ADAS, radar, infotainment, and powertrain control.
- AI Edge: Compact AI accelerators with compute + memory in low-power form factors.
Representative Providers
| Company | Specialty | Example Applications |
|---|---|---|
| Apple | Consumer SiP for wearables | Apple Watch S-series SiP |
| Qualcomm | RF front-end modules | 5G and WiFi SiP solutions |
| ASE | FO-WLP and SiP integration | IoT and consumer SiP modules |
| Amkor | Automotive and advanced SiPs | ADAS and connectivity SiPs |
Advantages & Constraints
- Advantages: Compact size; reduced interconnect parasitics; heterogeneous integration; faster time-to-market by combining existing dies.
- Constraints: Thermal and power delivery challenges in dense modules; design complexity; test cost; reliability issues for automotive and high-power use cases.
Cleanroom & Environment
- Performed in Class 1000–10,000 packaging environments, with finer bonding steps requiring tighter controls.
- Moisture sensitivity levels (MSL) critical for reliability, especially in automotive and high-temp markets.
- System-level testing required to validate multiple functional domains within one package.
Market Outlook
SiP is becoming the packaging method of choice for compact consumer and IoT devices. Apple popularized SiP in wearables, while automotive electronics are increasingly adopting SiP for radar and ADAS. By 2030, AI edge and sensor fusion devices will expand SiP adoption, while OSATs and foundries continue to refine FO-WLP and RDL technologies to support denser and more complex SiPs.