Three foundries
Tesla Buys Leading-Edge Logic From All Three Makers, and Terafab Ships Nothing Before 2028
Tesla designs its own AI inference chips and buys the wafers. It is now a customer of all three companies that build leading-edge logic in volume: Samsung Foundry, which makes AI4 at 7nm in Pyeongtaek, South Korea, and holds a $16.5 billion contract for AI5 and AI6 at Taylor, Texas; TSMC, which builds a second physical version of AI5 and, per Elon Musk, AI6 at its Arizona fabs; and Intel, which joined Terafab, the chipmaking program Tesla and SpaceX announced in Austin on March 21, 2026, as process partner on April 7, 2026.
Terafab is the long-term answer to foundry dependence, but it is late in the chip calendar. On Tesla's October 21, 2026 earnings call Musk said the Research Fab will begin commissioning machinery in the first half of 2027, make a first test chip "around May or June," and aim to make "some kind of useful chip at volume around Q3 of 2028." AI5 is due in Optimus "approximately April of next year." Every Tesla AI chip until Terafab ships at volume therefore comes from Samsung or TSMC.
Supply chain
Logic Has Three Routes; Memory Has One
- Made in US
- Some US volume
- US planned
- Made abroad
- Not disclosed
Logic has three routes. Memory has one: the same three DRAM makers that sell to every AI data center. Musk thanked Micron for allocating memory to Tesla on the July 2026 earnings call and said memory prices had climbed to unusual levels. Terafab's March 2026 plan listed memory alongside logic, masks and packaging, but its first stated output is logic test chips.
Chip family
Each Generation Has Its Own Foundry Path
| Chip | Primary use | Foundry and process | Status, October 2026 |
|---|---|---|---|
| HW3 (FSD Computer) | Vehicles built 2019 to 2023 | Samsung, 14nm | Legacy fleet |
| AI4 (HW4) | Current vehicles; dual-SoC board with 16GB of memory | Samsung, 7nm, Pyeongtaek, South Korea | Volume production; an upgraded AI4 board launches Cybercab |
| AI5 | Optimus and Tesla compute clusters first, then vehicles | Samsung Taylor (2nm-class gate-all-around) and TSMC (node not confirmed by Tesla) | Taped out April 2026; Samsung trial production at Taylor reported September 2026; in Optimus around April 2027 per Musk |
| AI6 | Low-power inference for Optimus, Cybercab and data centers | Samsung Taylor 2nm under the July 2025 contract; TSMC Arizona per Musk (November 2025) | In design; trade press puts volume at late 2027 at the earliest |
| AI7 / Dojo3 (D3) | Radiation-tolerant compute for SpaceX orbital satellites | Terafab Research Fab, then Production Fab; Intel 14A named | Shown at the March 2026 Terafab launch; no specification published |
| AI8, AI9 | Later generations | Not announced | Named by Musk in January 2026 with a nine-month design cycle target |
Foundry partners
Samsung, TSMC and Intel Each Hold a Different Piece
| Partner | Site | Process | Chips | Published terms |
|---|---|---|---|---|
| Samsung Foundry | Taylor, Texas | 2nm-class gate-all-around (SF2 family) | AI5, AI6 | $16.5B, eight years, through December 31, 2033; Musk called the figure a minimum |
| Samsung Foundry | Pyeongtaek, South Korea | 7nm | AI4, upgraded AI4 | Standard foundry supply |
| TSMC | Fab 21, Phoenix, Arizona, and Taiwan | Not confirmed for Tesla | AI5 second source; AI6 per Musk | None published; Tesla is one customer among Apple, NVIDIA and AMD |
| Intel Foundry | Terafab Research Fab and Production Fab, Texas | Intel 18A to start; Intel 14A named | AI7/D3 and later | Joined April 7, 2026; no volumes or terms; CEO Lip-Bu Tan confirmed the partnership October 7, 2026 |
| TSMC (Terafab talks) | Grimes County (proposed) | Not disclosed | Not disclosed | Musk confirmed talks October 3, 2026, with TSMC possibly subleasing part of the site |
Samsung Taylor
Samsung Taylor Is a Dedicated Line Tesla Does Not Own
Samsung and Tesla signed the Taylor contract on July 28, 2025: about $16.5 billion of supply through December 31, 2033. Samsung had planned Taylor for 4nm and moved the fab to 2nm gate-all-around after Tesla signed. Musk wrote that the fab "will be dedicated to making Tesla's next-generation AI6 chip" and that he would walk the line himself. AI5 was added to Taylor later.
Samsung held its equipment move-in ceremony on April 24, 2026, moved core engineers from Korea to secure first yields, and completed AI5 tape-out for its 2nm line in July 2026; Seoul Economic Daily reported trial AI5 production at Taylor in September 2026. Korean press reported Samsung 2nm yields rising from about 20% in late 2025 to the high 50s in 2026, against the roughly 60% usually needed for stable volume. Ramp production starts in 2027. Tesla gets most of the control of a captive fab while Samsung carries the capital; the AustinIO Samsung Taylor Fab page covers the campus and its supplier ring.
| Dimension | Standard foundry customer | Tesla at Samsung Taylor | Tesla and SpaceX at Terafab |
|---|---|---|---|
| Capacity | Negotiated allocation, reducible in a shortage | Fab described by Musk as dedicated to Tesla; $16.5B minimum over eight years | Set by Tesla and SpaceX investment |
| Process access | Yield and parametric data; no recipe access | Tesla engineers on the line, taking part in yield work | Full recipe control, starting from Intel process technology |
| Disruption exposure | An outage stops supply | TSMC builds a second physical version of AI5 | AI7/D3 has no announced second source |
| Capital on Tesla's books | None | None for the fab; committed purchases | $3B Tesla commitment for the Research Fab; $16.8B first phase at Grimes County, led by SpaceX |
AI5
AI5 Is One Design Built at Two Foundries
AI5 is the first Tesla chip built at two foundries at once. Samsung and TSMC each turn the same design into a slightly different physical chip, and Musk said in November 2025 that Tesla's software "works identically" on both. One AI5 replaces the dual-SoC AI4 board. Tesla has published AI5 performance only as ratios: about five times the useful compute of a full AI4 board, and, on the October 2026 call, "an order of magnitude more compute" than AI4. Capacity per board rises about ninefold if scaled from AI4's 16GB, which lands AI5 in the middle of the AI-driven shortage of LPDDR5 and high-bandwidth memory. The AI5 supply rows (Samsung and TSMC logic, SK hynix and Samsung memory, packaging not disclosed) are on the Tesla AI5 supplier ring.
AI7 and D3
The Radiation-Tolerant Chip Is the One Only Terafab Will Make
AI7, which Musk also calls Dojo3 and which appeared as D3 at the Terafab launch, is the SpaceX chip in the family: radiation-tolerant compute for 100 kW orbital server satellites. Commercial foundries rarely maintain a radiation-tolerant library and process variant for one customer at satellite volumes, and that is why D3 sits at Terafab rather than Samsung or TSMC. Until then SpaceX's first orbital data center satellite, AI1, uses NVIDIA Rubin GPUs and Vera CPUs in its Starmind payload, announced August 4, 2026. Rad-Hard and Rad-Tolerant Chips covers the design rules.
Terafab
Terafab Splits Process Development From Volume Production
Musk announced Terafab at the former Seaholm Power Plant in Austin on March 21, 2026, as one program for chip design, masks, logic, memory, advanced packaging and test, with a target of 1 terawatt of new AI compute a year. On the October 2026 call he put capital equipment at "not less than tens of billions" through early 2028 and "north of $100 billion long term"; Tesla's finance chief said most Research Fab tool orders are already placed. SpaceX's May 20, 2026 S-1 filing describes "a general framework" and states that neither Tesla nor Intel is obligated to stay in the project. Bernstein estimated in March 2026 that 1 TW of compute a year would take 140 to 360 new fabs of 50,000 wafer starts a month. SpaceX describes the Gibbons Creek production fab as one building of about 100 million square feet, at least 2.5 miles long, on more than 7,720 acres, where the retired 470 MW coal plant supplies the power rights, water and land; Governor Abbott announced the $16.8B first phase on August 6, 2026 with 3,000 jobs committed. Site, permitting, power and water detail are on AustinIO at Terafab Research Fab Giga Texas and Terafab Gibbons Creek.
Memory
Memory Is the Dependency Tesla Cannot Route Around
Tesla can split logic between Samsung and TSMC and plan a third source in Terafab, but memory has no Tesla-specific route. AI5's memory is its largest bill-of-materials exposure, and Tesla buys from SK hynix, Samsung and Micron at the same time as the hyperscalers building AI data centers. Reports conflict on AI5's memory supplier: Hankyung named SK hynix and Newsis named Samsung LPDDR5X. See DRAM and HBM for the supply picture.
US status
AI5 and AI6 Bring Tesla Logic to Texas and Arizona; Memory Stays in Asia
- Some US volume
- US planned
- Made abroad
- Not disclosed
| Step | Supplier | Site | US status |
|---|---|---|---|
| AI4 logic | Samsung Foundry | Pyeongtaek, South Korea | Made abroad |
| AI5 logic | Samsung Foundry | Taylor, Texas (trial production reported September 2026) | US planned |
| AI5 logic, second source | TSMC | Fab 21, Phoenix, Arizona, and Taiwan | US planned |
| AI6 logic | Samsung Foundry; TSMC per Musk | Taylor, Texas; Arizona | US planned |
| AI7/D3 logic | Terafab with Intel | Travis and Grimes counties, Texas | US planned |
| Memory | SK hynix, Samsung (reported); Micron | South Korea; Micron sites not disclosed | Made abroad |
| Packaging and test | Not disclosed | Not disclosed | Not disclosed |
Record
Page Record
- Covers
- Tesla AI chip generations and foundry paths, foundry terms, Samsung Taylor, AI5 dual sourcing, the D3 orbital chip, the two Terafab plants, memory dependency and US production status
- Sources
- Tesla third-quarter 2026 earnings call (October 21, 2026, transcript via The Motley Fool) and second-quarter call (July 2026, via Korea Economic Daily); Samsung and Tesla contract disclosure (July 28, 2025); Musk statements on X (July and November 2025, January and October 2026); Seoul Economic Daily (September 2026); SpaceX S-1 (May 20, 2026); Texas county and state filings (May and September 2026); Intel statements (April 7 and October 7, 2026); SpaceX Starmind announcement (August 4, 2026); Bernstein (March 2026); TrendForce, Hankyung and Newsis on AI5 memory (April 2026, reported); Samsung 2nm yields from Korean press (reported); ElectronsX covers the deployment side at Tesla Terafab and Silicon Strategy
- Last verified
- October 2026