Semiconductor Fab Clusters
In response to surging global chip demand, strategic incentives (e.g. the U.S. CHIPS & Science Act), and geopolitical pressure, the world’s leading semiconductor firms are committing **extraordinary capital** to build “mega-campus” fab clusters. These are not just single fabs—these are integrated ecosystems of fabs, advanced packaging, R&D, and infrastructure. This page summarizes what each major player is doing (in the U.S. or globally) today.
| Company | State | Location / Campus | Existing Fabs | New Fabs | Total US Investment |
|---|---|---|---|---|---|
| Intel | Arizona | Chandler / Ocotillo | 4 (Fabs 12, 22, 32, 42) | 4 (Advanced packaging) | $100 B+ |
| Intel | Ohio | New Albany / Silicon Heartland | 0 | 8 (Planned, phased) | $100 B+ |
| Intel | Oregon | Hillsboro / Ronler Acres | 4 (D1X, D1D, Fab 20, etc.) | 1 (Expansion module) | $100 B+ |
| Intel | New Mexico | Rio Rancho | 1 (Fab 11X) | 1 (Fab 9 – adv packaging) | $100 B+ |
| TSMC | Arizona | North Phoenix | 1 (Fab 1 – 4/5nm) | 5 (Fabs 2–6; 2/3nm) | $165 B |
| Samsung | Texas | Taylor and Austin Corridor | 2 (Austin DRAM/NAND/logic) | 10 (Taylor cluster planned) | $45 B |
| Texas Instruments | Texas | Sherman and Richardson | 1 (RFAB1 in Richardson) | 5 (Sherman: SM2–SM4, Richardson: RFAB2) | $60 B |
| Texas Instruments | Utah | Lehi / Salt Lake City | 1 (LFAB1) | 2 (LFAB2 + expansion) | $60 B |
| Micron | Idaho | Boise | 1 (R&D + production) | 2 (High-volume DRAM fabs) | $200 B |
| Micron | New York | Clay / Syracuse Area | 0 | 4 (Greenfield site) | $200 B |
| Micron | Virginia | Manassas | 1 (Assembly/test facility) | 0 (Facility expansion only) | $200 B |