CMP Equipment

Polishers with integrated clean · Applied, Ebara, KCTech, Accretech, Hwatsing

Applied Materials and Ebara supply most leading-edge CMP tools outside China. Inside China, Hwatsing Technology grew revenue 36.5% to 4.65 billion yuan in 2025, holds more than 90% of CMP tool sales by Chinese makers, and had shipped more than 1,000 tools by mid-2026.

Hwatsing Technology, China's CMP toolmaker, grew revenue from about 3.41 billion yuan in 2024 to 4.65 billion in 2025, and China Merchants Securities forecasts 5.88 billion for 2026. It had shipped more than 1,000 CMP tools by mid-2026 and holds more than 90% of CMP tool sales by Chinese makers. Outside China, CMP tools come from Applied Materials in the United States, Ebara and Accretech in Japan, and KCTech in Korea. HWATSING REVENUE, BILLION YUAN 2024 3.41 2025 4.65 2026 forecast 5.88 2024 DERIVED FROM 2025 GROWTH; 2026 IS A BROKER FORECAST 1,000+ CMP tools shipped by Hwatsing by mid-2026; more than 90% of CMP tool sales by Chinese makers WHO BUILDS CMP TOOLS United States APPLIED Japan EBARA ACCRETECH Korea KCTECH China HWATSING Two makers outside China, Applied and Ebara, supply most leading-edge CMP; Hwatsing supplies most Chinese fabs. HWATSING EXPRESS RESULTS (FEBRUARY 2026) AND CHINA MERCHANTS SECURITIES (AUGUST 2026).
Leading makers
Applied, Ebara
China maker
Hwatsing
Hwatsing revenue, 2025
4.65B yuan
Hwatsing tools shipped
1,000+
Entity List
Hwatsing, December 2024
Hub
Equipment

Who builds them

Two Makers Outside China Supply Most Leading-Edge CMP

Leading-edge CMP tools come mainly from two makers outside China. Applied Materials sells the Reflexion LK Prime family and has been the largest supplier for two decades. Ebara of Japan sells the F-REX series and is strongest in Japanese, Korean and Taiwanese memory fabs. KCTech supplies Korean chipmakers, and Accretech serves specialty and back-side work. Inside China, Hwatsing Technology supplies most fabs. The Information Network reported in September 2024 that Applied's share fell below half in 2023 as Hwatsing grew; no current share figure is public.

  • Made in US
  • Some US volume
  • US planned
  • Made abroad
CMP tool makers
MakerHomeFlagship toolsWhere tools are builtUS status
Applied MaterialsUnited StatesReflexion LK Prime; Mirra for 200mmUnited States and Singapore; Applied does not break out CMP by siteSome US volume
EbaraJapanF-REX300 seriesJapan (Fujisawa, Kumamoto)Made abroad
KCTechKoreaCMP tools and slurry for Samsung and SK hynixKoreaMade abroad
Tokyo Seimitsu (Accretech)JapanCMP and grinding for specialty and back-side workJapanMade abroad
Hwatsing TechnologyChinaUniversal-300 series 300mm CMP; Master-P510APEX panel CMP; thinning, dicing and implantChina (Tianjin)Made abroad
Placeholder: remaining makers from the dataset

How the polish works, where it runs in the flow and how it fails is covered on Planarization (CMP). Slurry and pad suppliers are on CMP Slurries.

Inside a CMP tool

A CMP Tool Is a Polisher and a Cleaner in One Frame

Top view of a typical CMP platform. Wafers enter from load ports, a robot hands each one to the polishing module, where carrier heads move it across three platens in turn: bulk removal, barrier removal and a final buff. The wafer then passes through an integrated clean module, with megasonic, two brush stations and a dryer, and returns dry to its pod. Layouts vary by maker. LOAD PORTS ROBOT Dryer IPA OR SPIN Brush 2 METAL IONS Brush 1 SLURRY Megasonic PARTICLES INTEGRATED CLEAN MODULE, WAFER MOVES RIGHT TO LEFT POLISHING MODULE Platen 1 BULK COPPER Platen 2 BARRIER Platen 3 BUFF Carrier head HOLDS WAFER FACE DOWN Platen and pad ROTATING, SLURRY FED Endpoint sensor IN EACH PLATEN Dry in, dry out WAFER LEAVES CLEAN TYPICAL LAYOUT; PLATEN AND HEAD COUNT VARY BY MAKER AND APPLICATION.

A CMP tool is a polisher and a cleaner in one frame, because a wafer cannot leave the tool with slurry drying on it. The industry calls this dry-in, dry-out. Copper wafers move across three platens in sequence: one for bulk copper, one for the barrier, one for a final buff. Each platen has its own pad, slurry and endpoint sensor, so the tool also carries a large consumables bill; pads and slurry are replaced on a schedule set by wafer count.

Hwatsing

China Built a CMP Maker That Has Shipped More Than 1,000 Tools

Hwatsing Technology was spun out of Tsinghua University and is listed on Shanghai's STAR Market. It reported 2025 revenue of 4.648 billion yuan, up 36.5%, and first-half 2026 revenue of 2.643 billion yuan, up 35.6%. China Merchants Securities said in August 2026 that Hwatsing holds more than 90% of CMP tool sales by Chinese makers and had shipped more than 1,000 CMP tools by mid-2026, in volume use at advanced logic, memory and packaging lines. The US added Hwatsing to the Entity List in December 2024.

Hwatsing product lines beyond CMP
LineProductsStatus, August 2026
ThinningVersatile-GH300 for 300mm memory, Versatile-GN200 for compound wafersMore than 20 thinning and polishing tools shipped
Ion implantiPUMA-LE and iPUMA-LT high-current implantersFirst tool delivered to a Chinese memory maker; low-temperature model in validation
Dicing and edgeDicing tools; Master-BN300 edge polisherRepeat edge polisher orders
Panel CMPMaster-P510APEX for 510 by 515mm panelsOrder from an advanced packaging customer
Wafer reclaimPolishing service for test and monitor wafers200,000 wafers a month in Tianjin, expanding toward 600,000 with Kunshan

China's CMP localization is reported in a range of about 20% to 35%, from industry estimates without one primary source. Bernstein did not report a CMP figure in its June 2026 localization estimates.

New markets

Hybrid Bonding and Panels Carry CMP Into Packaging

  • Hybrid bonding: copper-to-copper bonding for HBM4, TSMC SoIC and stacked image sensors needs a bonding surface flat to a few nanometers, which brings CMP tools into packaging lines. See Hybrid Bonding.
  • Panels: fan-out panel-level packaging moves CMP from round wafers to rectangular panels; Hwatsing has a panel CMP order from a packaging customer. See Fan-Out WLP.
  • Backside power: Intel 18A PowerVia and TSMC A16 thin the wafer from the back, which adds grinding and CMP passes on every wafer.
  • More metal layers: each added copper wiring layer adds a copper polish, so CMP tool demand rises with layer count. See Metallization.

Record

Page Record

Covers
CMP tool makers, platform layout, Hwatsing and new packaging markets
Sources
Hwatsing 2025 express results via 10jqka (February 27, 2026); China Merchants Securities note on Hwatsing first-half 2026 results via Gelonghui (August 25, 2026); The Information Network (CMP share, September 2024); US Entity List (December 2024); Bernstein via National Business Daily (June 11, 2026); CMP localization range is an industry estimate
Last verified
October 2026