At a glance
Chip Summary
| Item | Value |
|---|---|
| Designer | HiSilicon (Huawei) |
| Type | AI accelerator |
| Logic node | SMIC N+2 (7nm-class); some TSMC 7nm dies |
| Package | Two 910B dies, domestic advanced packaging |
| Memory | Stockpiled Samsung and SK hynix HBM; CXMT HBM3 next |
| Status | Mass production since Q1 2025 |
| Rack platform | CloudMatrix 384 on DatacentersX |
Supplier ring
Who Makes Each Part
- Made in US
- Some US volume
- US planned
- Made abroad
- Not disclosed
| Component | Supplier | Role | Made at | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Logic die | SMIC | Primary | Not disclosed (N+2 lines), Shanghai, China | Made abroad | Claimed Source | Two Ascend 910B dies per package; SMIC 7nm-class N+2 since Q3 2024; about eight months wafer start to module (JP Morgan) |
| Logic die | TSMC | Second source | Not disclosed, Taiwan | Made abroad | Confirmed Source | TechInsights teardown found TSMC dies; obtained via shell companies (Sophgo); about 3 million dies bought in 2024 (SemiAnalysis); TSMC says made before Oct 2024 and halted |
| MemoryHBM | Samsung | Primary | Not disclosed, South Korea | Made abroad | Confirmed Source | Earlier-generation HBM found in teardown; part of an estimated 11.7 million-stack stockpile bought before late-2024 controls |
| MemoryHBM | SK hynix | Second source | Not disclosed, South Korea | Made abroad | Confirmed Source | Found in TechInsights teardown |
| MemoryHBM | CXMT | Second source | Not disclosed, Hefei, China | Made abroad | Claimed Source | Projected about 2.2 million HBM stacks in 2026, enough for 250,000-400,000 910C packages; HBM3 sampling to Huawei |
| PackagingAdvanced packaging | Not disclosed | Primary | China | Made abroad | Inferred Source | Domestic packaging assumed; JCET, Tongfu and Xinxin named as CXMT HBM packaging partners, not confirmed for 910C |
| Final test | Not disclosed | Primary | China | Made abroad | Inferred |
US share
What Is Made, or Planned, in the US
No part of the Huawei Ascend 910C is made in the US or planned there on current evidence.
Record
Dataset Record
- Dataset
- Supplier ring for Huawei Ascend 910C: 7 rows from sx_chip_rings
- Sources
- Source link on each row
- Last verified
- 2026-10