Google TPU Ironwood Supplier Ring

TSMC N3P - CoWoS - 192GB HBM3E

8 supplier rows: 0 with US volume today and 0 US planned.

Supplier ring for Google TPU Ironwood: 6 components around the chip, each shaded by the most US status any of its suppliers has Logic die TSMC Memory SK HYNIX, SAMSUNG Substrate IBIDEN, SHINKO ELECTRIC ABF film AJINOMOTO Packaging TSMC Final test NOT DISCLOSED Google TPU Ironwood 8 SUPPLIER ROWS MADE IN US SOME US VOLUME US PLANNED MADE ABROAD NOT DISCLOSED
Supplier rows
8
Memory suppliers
2
US now
0
US planned
0
Rack platform
TPU v7 Ironwood pod
Hub
Chips

At a glance

Chip Summary

Google TPU Ironwood at a glance
ItemValue
DesignerGoogle and Broadcom
TypeASIC
Logic nodeTSMC N3P
PackageCoWoS
Memory192GB HBM3E
StatusVolume
Rack platformTPU v7 Ironwood pod on DatacentersX

Supplier ring

Who Makes Each Part

  • Made in US
  • Some US volume
  • US planned
  • Made abroad
  • Not disclosed
Supplier ring for Google TPU Ironwood
ComponentSupplierRoleMade atUS statusEvidenceNotes
Logic dieTSMCSoleTaiwanMade abroadClaimed SourceTSMC N3P; Broadcom design partner
MemoryHBMSamsungPrimaryPyeongtaek, Pyeongtaek, South KoreaMade abroadClaimed SourceHBM3E, 192GB; about 60% of supply via Broadcom
MemoryHBMSK hynixSecond sourceM16, Icheon, South KoreaMade abroadClaimed SourceAbout 40% of supply
SubstratePackage substrateIbidenPrimaryOgaki area, JapanMade abroadClaimed Source
SubstratePackage substrateShinko ElectricSecond sourceNagano, JapanMade abroadClaimed Source
ABF filmAjinomotoSoleKawasaki area, JapanMade abroadClaimed Source
PackagingAdvanced packagingTSMCSoleCoWoS lines, TaiwanMade abroadClaimed Source
Final testNot disclosedPrimaryNot disclosedNot disclosedInferredNo test house named

US share

What Is Made, or Planned, in the US

No part of the Google TPU Ironwood is made in the US or planned there on current evidence.

Record

Dataset Record

Dataset
Supplier ring for Google TPU Ironwood: 8 rows from sx_chip_rings
Sources
Source link on each row
Last verified
2026-10