At a glance
Chip Summary
| Item | Value |
|---|---|
| Designer | Apple |
| Type | Smartphone SoC |
| Logic node | TSMC N3P |
| Package | InFO-PoP (inferred) |
| Memory | None; LPDDR5X |
| Status | Shipping since Sep 2025 |
| Rack platform | None |
Supplier ring
Who Makes Each Part
- Made in US
- Some US volume
- US planned
- Made abroad
- Not disclosed
| Component | Supplier | Role | Made at | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Logic die | TSMC | Sole | Not disclosed (TSMC N3 fabs in Tainan), Taiwan | Made abroad | Confirmed Source | N3P; die area 98.6 mm2; TSMC Arizona makes N4 Apple chips (A16) and starts N3 in 2H 2027, so A19 Pro is not US-made |
| MemoryDRAM | Samsung | Primary | Not disclosed, South Korea | Made abroad | Claimed Source | LPDDR5X; Samsung reported as primary iPhone 17 memory supplier |
| MemoryDRAM | Not disclosed | Second source | Not disclosed | Not disclosed | Inferred | SK hynix and Micron are Apple memory suppliers historically; not confirmed for A19 Pro |
| PackagingAdvanced packaging | TSMC | Sole | Not disclosed, Taiwan | Made abroad | Inferred | InFO-PoP, used on Apple A-series since A10; not confirmed for A19 Pro in a cited source |
| Final test | Not disclosed | Primary | Not disclosed | Not disclosed | Inferred |
US share
What Is Made, or Planned, in the US
No part of the Apple A19 Pro is made in the US or planned there on current evidence.
Record
Dataset Record
- Dataset
- Supplier ring for Apple A19 Pro: 5 rows from sx_chip_rings
- Sources
- Source link on each row
- Last verified
- 2026-10