AWS Trainium3 Supplier Ring

TSMC N3P - TSMC CoWoS-R, two assemblies - HBM3E 12-high, 144 GB

64- and 144-chip UltraServer configurations 8 supplier rows: 0 with US volume today and 0 US planned.

Supplier ring for AWS Trainium3: 7 components around the chip, each shaded by the most US status any of its suppliers has Logic die TSMC Memory MICRON, SK HYNIX Interposer TSMC Substrate NOT DISCLOSED ABF film AJINOMOTO Packaging TSMC Final test NOT DISCLOSED AWS Trainium3 8 SUPPLIER ROWS MADE IN US SOME US VOLUME US PLANNED MADE ABROAD NOT DISCLOSED
Supplier rows
8
Memory suppliers
2
US now
0
US planned
0
Rack platform
Trainium3 UltraServer
Hub
Chips

At a glance

Chip Summary

AWS Trainium3 at a glance
ItemValue
DesignerAWS (Annapurna Labs)
TypeAI accelerator
Logic nodeTSMC N3P
PackageTSMC CoWoS-R, two assemblies
MemoryHBM3E 12-high, 144 GB
StatusGenerally available Dec 2025
Rack platformTrainium3 UltraServer on DatacentersX

Supplier ring

Who Makes Each Part

  • Made in US
  • Some US volume
  • US planned
  • Made abroad
  • Not disclosed
Supplier ring for AWS Trainium3
ComponentSupplierRoleMade atUS statusEvidenceNotes
Logic dieTSMCSoleNot disclosed (TSMC N3 fabs are in Taiwan), TaiwanMade abroadClaimed SourceN3P; Alchip did back-end physical and package design for one mask set (Anita); Annapurna owns the higher-volume Mariana set; Marvell lost the Trainium3 contest
MemoryHBMSK hynixPrimaryNot disclosed, South KoreaMade abroadClaimed Source12-high HBM3E; 144 GB per chip in four stacks
MemoryHBMMicronSecond sourceNot disclosed, Taiwan or JapanMade abroadClaimed SourceMicron HBM is made in Taiwan and Japan; Samsung supplied Trainium2 but not Trainium3
InterposerInterposer or bridgeTSMCSoleNot disclosed, TaiwanMade abroadClaimed SourceCoWoS-R organic thin-film interposer; two CoWoS-R assemblies per package
SubstratePackage substrateNot disclosedPrimaryNot disclosedNot disclosedClaimed Source20-layer ABF substrate; supplier not named
ABF filmAjinomotoPrimaryJapanMade abroadInferredAjinomoto supplies more than 95% of ABF film worldwide; not confirmed for this chip
PackagingAdvanced packagingTSMCPrimaryNot disclosed, TaiwanMade abroadClaimed SourceCoWoS-R; all TSMC CoWoS runs in Taiwan today
Final testNot disclosedPrimaryNot disclosedNot disclosedInferredNo test supplier named

US share

What Is Made, or Planned, in the US

No part of the AWS Trainium3 is made in the US or planned there on current evidence.

Record

Dataset Record

Dataset
Supplier ring for AWS Trainium3: 8 rows from sx_chip_rings
Sources
Source link on each row
Last verified
2026-10