AMD MI455X Supplier Ring

TSMC N2 (compute), N3P (base and I/O) - SoIC plus CoWoS-L - 432GB HBM4

Eight compute dies hybrid-bonded on two base dies 11 supplier rows: 0 with US volume today and 0 US planned.

Supplier ring for AMD MI455X: 7 components around the chip, each shaded by the most US status any of its suppliers has Logic die TSMC Memory NOT DISCLOSED, SAMSUNG Interposer TSMC Substrate KINSUS, NAN YA PCB + ABF film AJINOMOTO Packaging TSMC Final test NOT DISCLOSED AMD MI455X 11 SUPPLIER ROWS MADE IN US SOME US VOLUME US PLANNED MADE ABROAD NOT DISCLOSED
Supplier rows
11
Memory suppliers
2
US now
0
US planned
0
Rack platform
Helios
Hub
Chips

At a glance

Chip Summary

AMD MI455X at a glance
ItemValue
DesignerAMD
TypeGPU
Logic nodeTSMC N2 (compute), N3P (base and I/O)
PackageSoIC plus CoWoS-L
Memory432GB HBM4
StatusRamping, volume from 2026-H2
Rack platformHelios on DatacentersX

Supplier ring

Who Makes Each Part

  • Made in US
  • Some US volume
  • US planned
  • Made abroad
  • Not disclosed
Supplier ring for AMD MI455X
ComponentSupplierRoleMade atUS statusEvidenceNotes
Logic dieTSMCSoleTaiwanMade abroadConfirmed SourceEight compute dies (XCD) on TSMC N2; TSMC Arizona not producing N2 yet
Logic dieI/O or base dieTSMCSoleTaiwanMade abroadConfirmed SourceTwo fabric and cache dies (FCD) and two I/O dies on TSMC N3P
MemoryHBMSamsungPrimaryPyeongtaek, Pyeongtaek, South KoreaMade abroadCommitted SourceHBM4, 12 stacks, 432GB; MOU names Samsung primary, not exclusive
MemoryHBMNot disclosedSecond sourceNot disclosedNot disclosedClaimed SourceSK hynix or Micron possible; matches the DatacentersX Helios ring
InterposerInterposer or bridgeTSMCSoleSoIC and CoWoS-L lines, TaiwanMade abroadConfirmed SourceCompute dies hybrid-bonded onto FCDs (SoIC), then joined with HBM4 on CoWoS-L
SubstratePackage substrateUnimicronPrimaryTaoyuan, TaiwanMade abroadCommitted SourceNamed in AMD Taiwan ecosystem release
SubstratePackage substrateNan Ya PCBSecond sourceTaiwanMade abroadCommitted Source
SubstratePackage substrateKinsusSecond sourceTaiwanMade abroadCommitted Source
ABF filmAjinomotoSoleKawasaki area, JapanMade abroadClaimed Source
PackagingAdvanced packagingTSMCPrimaryCoWoS-L lines, TaiwanMade abroadClaimed Source
Final testNot disclosedPrimaryNot disclosedNot disclosedInferredNo test house named for MI455X

US share

What Is Made, or Planned, in the US

No part of the AMD MI455X is made in the US or planned there on current evidence.

Record

Dataset Record

Dataset
Supplier ring for AMD MI455X: 11 rows from sx_chip_rings
Sources
Source link on each row
Last verified
2026-10