At a glance
Chip Summary
| Item | Value |
|---|---|
| Designer | NVIDIA |
| Type | GPU |
| Logic node | TSMC 4NP |
| Package | CoWoS-L |
| Memory | 288GB HBM3E 12-high |
| Status | Volume |
| Rack platform | GB300 NVL72 on DatacentersX |
Supplier ring
Who Makes Each Part
- Made in US
- Some US volume
- US planned
- Made abroad
- Not disclosed
| Component | Supplier | Role | Made at | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Logic die | TSMC | Primary | Fab 18, Tainan, Taiwan | Made abroad | Claimed Source | Two reticle-size dies on TSMC 4NP; Fab 18 is the main N4/N5 site (plant inferred) |
| Logic die | TSMC Arizona | Second source | Fab 21, Phoenix, USA | Some US volume | Confirmed Source | First Blackwell wafer at Fab 21 on Oct 17 2025; share of B300 volume not disclosed; wafers return to Taiwan for packaging |
| MemoryHBM | SK hynix | Primary | M16, Icheon, South Korea | Made abroad | Claimed Source | 12-high HBM3E; reported exclusive at launch |
| MemoryHBM | Micron | Second source | Hiroshima and Taichung, Japan and Taiwan | Made abroad | Confirmed Source | TechInsights teardown found Micron HBM3E in an HGX B300; Micron has no US HBM output |
| MemoryHBM | Samsung | Second source | Pyeongtaek, Pyeongtaek, South Korea | Made abroad | Claimed Source | 12-high HBM3E for GB300 after qualification |
| InterposerInterposer or bridge | TSMC | Sole | CoWoS-L lines, Taiwan | Made abroad | Claimed Source | CoWoS-L uses local silicon interconnect bridges in an organic interposer |
| SubstratePackage substrate | Ibiden | Primary | Ogaki area, Japan | Made abroad | Claimed Source | Ibiden is NVIDIA's main AI GPU substrate supplier; other sources not confirmed |
| ABF film | Ajinomoto | Sole | Kawasaki area, Japan | Made abroad | Claimed Source | Ajinomoto holds more than 95% of ABF film |
| PackagingAdvanced packaging | TSMC | Sole | CoWoS-L lines, Taiwan | Made abroad | Claimed Source | All TSMC CoWoS capacity is in Taiwan; Amkor Peoria AZ is due 2027-2028 |
| Final test | KYEC | Primary | Hsinchu and Miaoli, Taiwan | Made abroad | Claimed Source | ASE also takes Blackwell test orders |
| Final test | ASE | Second source | Kaohsiung, Taiwan | Made abroad | Claimed Source |
US share
What Is Made, or Planned, in the US
- Logic die: TSMC Arizona, Fab 21 (some us volume). First Blackwell wafer at Fab 21 on Oct 17 2025; share of B300 volume not disclosed; wafers return to Taiwan for packaging
Record
Dataset Record
- Dataset
- Supplier ring for NVIDIA B300: 11 rows from sx_chip_rings
- Sources
- Source link on each row
- Last verified
- 2026-10