At a glance
Chip Summary
| Item | Value |
|---|---|
| Designer | Microsoft |
| Type | ASIC |
| Logic node | TSMC 3nm |
| Package | CoWoS (inferred) |
| Memory | 216GB HBM3E |
| Status | Deploying 2026 |
| Rack platform | Maia 200 on DatacentersX |
Supplier ring
Who Makes Each Part
- Made in US
- Some US volume
- US planned
- Made abroad
- Not disclosed
| Component | Supplier | Role | Made at | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Logic die | TSMC | Sole | Taiwan | Made abroad | Confirmed Source | TSMC 3nm; Microsoft announced January 2026 |
| MemoryHBM | SK hynix | Sole | M16, Icheon, South Korea | Made abroad | Claimed Source | 216GB HBM3E; reported sole supplier |
| SubstratePackage substrate | Not disclosed | Primary | Not disclosed | Not disclosed | Inferred | No substrate supplier named |
| ABF film | Ajinomoto | Sole | Kawasaki area, Japan | Made abroad | Claimed Source | |
| PackagingAdvanced packaging | TSMC | Primary | CoWoS lines, Taiwan | Made abroad | Inferred | HBM on a reticle-class die needs 2.5D packaging; TSMC CoWoS is the only volume option for a TSMC 3nm die |
| Final test | Not disclosed | Primary | Not disclosed | Not disclosed | Inferred | No test house named |
US share
What Is Made, or Planned, in the US
No part of the Microsoft Maia 200 is made in the US or planned there on current evidence.
Record
Dataset Record
- Dataset
- Supplier ring for Microsoft Maia 200: 6 rows from sx_chip_rings
- Sources
- Source link on each row
- Last verified
- 2026-10