TSMC AP6 (Zhunan)

TSMC - Zhunan, Taiwan - SoIC, CoWoS - Operational

TSMC advanced backend fab for SoIC

Capacity of TSMC AP6 (Zhunan) against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
TSMC
Node
SoIC, CoWoS
Wafer
300mm
Capacity
Not disclosed
Opened
2023
US status
Made abroad

Fab record

Fab Record

Every field of the FAB194 row in the SemiconductorX fab dataset.

Fab record FAB194
GroupFieldValue
IdentityFab IDFAB194
NameTSMC AP6 (Zhunan)
OperatorTSMC
Parent companyTSMC
LocationCityZhunan
State or regionMiaoli
CountryTaiwan
Region groupTaiwan Strait Risk
Supply-chain riskHigh
ProcessFab typePackaging
CategoryAdvanced Packaging
Process nodeSoIC, CoWoS
Wafer size300mm
Products3D stacking and 2.5D packaging
Customers
StatusStatusOperational
Year opened or due2023
CapacityNot disclosed
US statusMade abroad
SourcesSourceTSMC
Source linkNone
AustinIO pageNone
Last verified2026-10

Same operator

Other TSMC Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB194
Sources
TSMC
Last verified
2026-10