TSMC AP7 (Chiayi)

TSMC - Chiayi, Taiwan - CoWoS, SoIC - Ramp

Main Taiwan site of the expansion toward about 260,000 CoWoS wafers a month by end 2028 (investor estimate)

Capacity of TSMC AP7 (Chiayi) against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
TSMC
Node
CoWoS, SoIC
Wafer
300mm
Capacity
Not disclosed
Opened
2025
US status
Made abroad

Fab record

Fab Record

Every field of the FAB193 row in the SemiconductorX fab dataset.

Fab record FAB193
GroupFieldValue
IdentityFab IDFAB193
NameTSMC AP7 (Chiayi)
OperatorTSMC
Parent companyTSMC
LocationCityChiayi
State or regionChiayi
CountryTaiwan
Region groupTaiwan Strait Risk
Supply-chain riskHigh
ProcessFab typePackaging
CategoryAdvanced Packaging
Process nodeCoWoS, SoIC
Wafer size300mm
ProductsAI accelerator packaging
CustomersNVIDIA, AMD
StatusStatusRamp
Year opened or due2025
CapacityNot disclosed
US statusMade abroad
SourcesSourceTrendForce
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other TSMC Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB193
Sources
TrendForce
Last verified
2026-10