Intel Fab 9 (Rio Rancho)

Intel - Rio Rancho, New Mexico - Foveros, EMIB, EMIB-T - Operational

Opened January 2024; packages at 8x reticle today, over 12x by 2028

Capacity of Intel Fab 9 (Rio Rancho) against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
Intel
Node
Foveros, EMIB, EMIB-T
Wafer
300mm
Capacity
Not disclosed
Opened
2024
US status
Made in US

Fab record

Fab Record

Every field of the FAB192 row in the SemiconductorX fab dataset.

Fab record FAB192
GroupFieldValue
IdentityFab IDFAB192
NameIntel Fab 9 (Rio Rancho)
OperatorIntel
Parent companyIntel
LocationCityRio Rancho
State or regionNew Mexico
CountryUSA
Region groupUS Domestic
Supply-chain riskLow
ProcessFab typePackaging
CategoryAdvanced Packaging
Process nodeFoveros, EMIB, EMIB-T
Wafer size300mm
Products3D and 2.5D packaging for Intel and foundry customers
CustomersIntel internal; Intel Foundry customers
StatusStatusOperational
Year opened or due2024
CapacityNot disclosed
US statusMade in US
SourcesSourceIntel newsroom
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other Intel Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB192
Sources
Intel newsroom
Last verified
2026-10