TSMC Arizona Advanced Packaging

TSMC - Phoenix, Arizona - CoWoS, SoIC - Planned

Work starting 2026; investor estimates name Arizona AP9 and AP10 in the 2028 expansion

Capacity of TSMC Arizona Advanced Packaging against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
TSMC
Node
CoWoS, SoIC
Wafer
300mm
Capacity
Not disclosed
Opened
Before 2029
US status
US planned

Fab record

Fab Record

Every field of the FAB191 row in the SemiconductorX fab dataset.

Fab record FAB191
GroupFieldValue
IdentityFab IDFAB191
NameTSMC Arizona Advanced Packaging
OperatorTSMC
Parent companyTSMC
LocationCityPhoenix
State or regionArizona
CountryUSA
Region groupUS Domestic
Supply-chain riskLow
ProcessFab typePackaging
CategoryAdvanced Packaging
Process nodeCoWoS, SoIC
Wafer size300mm
ProductsAI accelerator packaging
Customers
StatusStatusPlanned
Year opened or dueBefore 2029
CapacityNot disclosed
US statusUS planned
SourcesSourceTrendForce
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other TSMC Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB191
Sources
TrendForce
Last verified
2026-10