SemiconductorX > Fab & Assembly > TSMC CoWoS Advanced Packaging (Taichung)
TSMC CoWoS Advanced Packaging (Taichung)
[Last updated: Apr 2026]
This semiconductor fab is located in Taichung, Taiwan.
| Fab: | TSMC CoWoS Advanced Packaging (Taichung) Gigafactory |
| Company: | TSMC |
| Owner: | TSMC |
| City: | Taichung |
| State: | Taichung |
| Country: | Taiwan |
| Geopolitical: | Taiwan Strait Risk (HIGH risk) | Node/Line: | CoWoS-S/L/R |
| Category: | Advanced Packaging |
| Wafer size: | 300.00 nm |
| Product: | AI GPU + HBM CoWoS packages |
| Fab type: | Packaging |
| Status: | Operational/Expanding |
| Capacity: | 40 kWSPM |
| Customers: | Nvidia (H100/H200/B200), AMD (MI300) |
Notes: Critical AI supply bottleneck 2023-24; CoWoS capacity gating Nvidia shipments
source: TSMC packaging reports 2024