Amkor Arizona (Peoria)

Amkor Technology - Peoria, Arizona - 2.5D, advanced packaging and test - Construction

104-acre campus plus 67 acres; 10-year TSMC agreement June 2026; production early 2028

Capacity of Amkor Arizona (Peoria) against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
Amkor Technology
Node
2.5D, advanced packaging and test
Wafer
300mm
Capacity
Not disclosed
Opened
2028
US status
US planned

Fab record

Fab Record

Every field of the FAB190 row in the SemiconductorX fab dataset.

Fab record FAB190
GroupFieldValue
IdentityFab IDFAB190
NameAmkor Arizona (Peoria)
OperatorAmkor Technology
Parent companyAmkor
LocationCityPeoria
State or regionArizona
CountryUSA
Region groupUS Domestic
Supply-chain riskLow
ProcessFab typePackaging
CategoryAdvanced Packaging
Process node2.5D, advanced packaging and test
Wafer size300mm
ProductsAdvanced packaging and test for TSMC Arizona wafers
CustomersTSMC, Apple, NVIDIA
StatusStatusConstruction
Year opened or due2028
CapacityNot disclosed
US statusUS planned
SourcesSourceAmkor release; TrendForce
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other Amkor Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB190
Sources
Amkor release; TrendForce
Last verified
2026-10