TSMC Fab 22 (N2)

TSMC - Kaohsiung, Taiwan - N2, A16 - Operational/Ramp

Phase 1 in N2 volume; phases 2 and 3 ramp 2H 2026

Capacity of TSMC Fab 22 (N2) against the largest leading-edge logic fabs in the SemiconductorX dataset, in thousand wafer starts a month LEADING-EDGE LOGIC FABS, THOUSAND WAFERS A MONTH Intel Ohio New Albany 100 TSMC Fab 18 100 Samsung Pyeongtaek P3 80 Intel Fab 34 60 Samsung Hwaseong S3 60 TSMC Fab 20 50 Intel Fab 52 40 TSMC Fab 21 phase 1 35 Rapidus IIM-1 25 Samsung Taylor Texas 25 TSMC Fab 21 phase 2 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
TSMC
Node
N2, A16
Wafer
300mm
Capacity
Not disclosed
Opened
2025
US status
Made abroad

Fab record

Fab Record

Every field of the FAB110 row in the SemiconductorX fab dataset.

Fab record FAB110
GroupFieldValue
IdentityFab IDFAB110
NameTSMC Fab 22 (N2)
OperatorTSMC
Parent companyTSMC
LocationCityKaohsiung
State or regionKaohsiung
CountryTaiwan
Region groupTaiwan Strait Risk
Supply-chain riskHigh
ProcessFab typeLogic
CategoryLeading Edge
Process nodeN2, A16
Wafer size300mm
ProductsAI accelerators, mobile SoCs
Customers
StatusStatusOperational/Ramp
Year opened or due2025
CapacityNot disclosed
US statusMade abroad
SourcesSource
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other TSMC Fabs

Same type, in the US

Other US Leading-Edge Logic Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB110
Sources
See the source link in the record
Last verified
2026-10