SemiconductorX > Fab & Assembly > Intel Penang (Back-end/Packaging)
Intel Penang (Back-end/Packaging)
[Last updated: Apr 2026]
This semiconductor fab is located in Penang, Malaysia.
| Fab: | Intel Penang (Back-end/Packaging) Gigafactory |
| Company: | Intel |
| Owner: | Intel |
| City: | Penang |
| State: | Penang |
| Country: | Malaysia |
| Geopolitical: | Allied (LOW risk) | Node/Line: | Flip chip, EMIB |
| Category: | Advanced Packaging |
| Wafer size: | 300.00 nm |
| Product: | Xeon, GPU die packaging |
| Fab type: | Packaging |
| Status: | Operational |
| Capacity: | 40 kWSPM |
| Customers: | Intel internal |
Notes: Intel's oldest overseas site; EMIB 2.5D packaging for GPU tiles
source: Intel manufacturing reports