Micron Singapore HBM Packaging

Micron - Singapore, Singapore - HBM stacking - Ramp

About $7 billion; operations 2026, major expansion 2027

Capacity of Micron Singapore HBM Packaging against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
Micron
Node
HBM stacking
Wafer
300mm
Capacity
Not disclosed
Opened
2026
US status
Made abroad

Fab record

Fab Record

Every field of the FAB195 row in the SemiconductorX fab dataset.

Fab record FAB195
GroupFieldValue
IdentityFab IDFAB195
NameMicron Singapore HBM Packaging
OperatorMicron
Parent companyMicron
LocationCitySingapore
State or regionSingapore
CountrySingapore
Region groupAllied
Supply-chain riskLow
ProcessFab typePackaging
CategoryAdvanced Packaging
Process nodeHBM stacking
Wafer size300mm
ProductsHBM advanced packaging
CustomersNVIDIA, AMD
StatusStatusRamp
Year opened or due2026
CapacityNot disclosed
US statusMade abroad
SourcesSourceSingapore EDB
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other Micron Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB195
Sources
Singapore EDB
Last verified
2026-10