Samsung Cheonan Packaging

Samsung Memory - Cheonan, South Korea - HBM stacking, I-Cube - Operational

Capacity shifting to HBM; conventional modules moved to outside suppliers

Capacity of Samsung Cheonan Packaging against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
Samsung Memory
Node
HBM stacking, I-Cube
Wafer
300mm
Capacity
Not disclosed
Opened
Not disclosed
US status
Made abroad

Fab record

Fab Record

Every field of the FAB198 row in the SemiconductorX fab dataset.

Fab record FAB198
GroupFieldValue
IdentityFab IDFAB198
NameSamsung Cheonan Packaging
OperatorSamsung Memory
Parent companySamsung
LocationCityCheonan
State or regionSouth Chungcheong
CountrySouth Korea
Region groupAllied
Supply-chain riskLow
ProcessFab typePackaging
CategoryAdvanced Packaging
Process nodeHBM stacking, I-Cube
Wafer size300mm
ProductsHBM and advanced packaging
Customers
StatusStatusOperational
Year opened or due
CapacityNot disclosed
US statusMade abroad
SourcesSourceTrendForce
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other Samsung Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB198
Sources
TrendForce
Last verified
2026-10