SK Hynix Cheongju P&T7

SK Hynix - Cheongju, South Korea - HBM stacking - Planned

Part of KRW 20 trillion Cheongju packaging budget; dates not disclosed

Capacity of SK Hynix Cheongju P&T7 against the largest packaging and test fabs in the SemiconductorX dataset, in thousand wafer starts a month PACKAGING AND TEST FABS, THOUSAND WAFERS A MONTH ASE Kaohsiung 100 Amkor Korea 60 JCET Jiangyin 60 Intel Penang 40 SPIL Taichung 30 Tongfu Microelectronics Hefei 20 INDIGO: US FABS. CAPACITY IS THE DATASET ESTIMATE; MOST OPERATORS DO NOT DISCLOSE IT.
Operator
SK Hynix
Node
HBM stacking
Wafer
300mm
Capacity
Not disclosed
Opened
Not disclosed
US status
Made abroad

Fab record

Fab Record

Every field of the FAB196 row in the SemiconductorX fab dataset.

Fab record FAB196
GroupFieldValue
IdentityFab IDFAB196
NameSK Hynix Cheongju P&T7
OperatorSK Hynix
Parent companySK Group
LocationCityCheongju
State or regionNorth Chungcheong
CountrySouth Korea
Region groupAllied
Supply-chain riskLow
ProcessFab typePackaging
CategoryAdvanced Packaging
Process nodeHBM stacking
Wafer size300mm
ProductsHBM packaging
Customers
StatusStatusPlanned
Year opened or due
CapacityNot disclosed
US statusMade abroad
SourcesSourceCompany announcement July 2026
Source linkLink
AustinIO pageNone
Last verified2026-10

Same operator

Other SK Group Fabs

Same type, in the US

Other US Packaging and Test Fabs

Record

Dataset Record

Dataset
SemiconductorX fab dataset (fabs2026), row FAB196
Sources
Company announcement July 2026
Last verified
2026-10