Semiconductor Dicing & Die Prep
Dicing and die preparation are the first critical steps in semiconductor back-end manufacturing. After wafers are processed in the fab, they must be separated into individual dies and prepared for packaging. These steps require extreme precision: as wafers have grown larger (300 mm, moving toward 450 mm) and dies have become thinner, the risk of breakage, edge chipping, and contamination has increased. Efficient dicing maximizes usable dies per wafer and directly impacts packaging yield and cost.
Role in Packaging
- Separates processed wafers into thousands of individual dies.
- Thins wafers to reduce package height and enable advanced packaging.
- Prepares die surfaces for mounting and interconnection.
- Determines effective wafer yield by minimizing mechanical and contamination damage.
Dicing & Die Prep Methods
- Saw Dicing: Diamond-coated blades cut through wafer streets; common for legacy and cost-sensitive applications.
- Laser Dicing: High-precision laser ablation reduces chipping and enables narrow street widths.
- Stealth Dicing: Laser-induced subsurface cleaving technique; reduces debris and improves die strength.
- Wafer Thinning: Backgrinding or CMP reduces wafer thickness (often 50–100 µm) for advanced packaging.
- Die Pick & Place: Automated systems separate and position dies for attachment.
Dicing & Die Prep Mapping
| Step | Function | Key Vendors | Notes |
|---|---|---|---|
| Saw Dicing | Mechanical blade cutting | Disco, Kulicke & Soffa | Legacy, cost-effective, higher risk of chipping |
| Laser Dicing | Laser ablation of wafer streets | Disco, Hamamatsu | Finer cuts, reduced debris |
| Stealth Dicing | Subsurface laser cleaving | Hamamatsu, Disco | Cleaner separation, higher die strength |
| Wafer Thinning | Backgrinding / CMP thinning | Disco, Tokyo Seimitsu | Reduces to 50–100 µm for 3D packaging |
| Die Pick & Place | Automated die handling | ASMPT, Besi | Critical for throughput and contamination control |
Risks & Bottlenecks
- Mechanical Stress: Thin wafers and small dies are prone to cracking during sawing or thinning.
- Contamination: Particles and debris from dicing can compromise downstream packaging steps.
- Tool Dependence: Disco dominates global dicing saw market, creating supplier concentration risk.
- Yield Loss: Each percent of damage in dicing translates directly into lost good dies per wafer.
KPIs to Track
- Die Yield (%): Proportion of usable dies after dicing.
- Chipping Rate: % of dies damaged during cut or thinning.
- Street Width (µm): Narrower widths increase dies per wafer but require precision dicing.
- Throughput (wafers/hour): Tool productivity metric.
Market Outlook
The wafer dicing and die preparation equipment market was valued at ~$1.2B in 2023 and is projected to reach ~$1.8B by 2030, with a CAGR of ~6%. Demand is driven by advanced packaging (2.5D/3D stacking, chiplets) that require ultra-thin dies and high-yield separation. Supplier concentration around Disco and ASMPT represents a strategic vulnerability for the industry.
FAQs
- How thin can wafers be made? – Thinned wafers can reach 50 µm or less for 3D integration, though handling becomes challenging.
- Why use stealth dicing? – It reduces debris and mechanical stress, improving yield for fragile dies.
- Are dicing and thinning always co-located? – Often yes, but some fabs outsource thinning to OSAT partners.
- What’s the biggest cost factor? – Tooling and yield loss; every additional good die per wafer translates into millions in revenue.
